Layer count: 40
Board thickness:3.0mm
Dimension:158*83.21mm
Raw material:FR4 TG170 tuc
Copper thickness on the board surface:140um
Copper thickness in the hole barrel:50um
Min.line width/space:0.30mm
Minimum hole diameter:0.4mm
Surface finishing:immersion gold≥1u"
Application:telecom power supply