HDI for telecom module
- Specification
Layer count: 1 stage 4 layer
Board thickness：0.6mm
Dimension：128*100.89mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm
Surface finishing：immersion gold≥2u"+OSP
Application：telecom module
Asian Electronics Tech Limited
Company Address: Flat/RM 25-26 1/F, Chi Fai Court 31-35 Tai Po Road, Kowloon, HK.Factory Address: Zhenlong Changlong Industrial Area, Huizhou City, Guangdong Province, PRC
Mob: +86-135 554 4762 Tel：+86-750-3663039 Fax: +86-750-3663038 Skype: samers8872535
E-mail:samers@asianpcbtech.com
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